Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI Technology has been one of the leading forces in development and patented applications of advanced material and adhesive solution for electronic interconnection and packaging. AI Technology now has one of the high reliability adhesives and underfills for die bonding for the largest dies, stack-chip packaging with dicing die-attach film (DDAF), flip-chip bonding and underfilling and high temperature die bonding for single and multiple-chip modules for applications beyond 230°C. The company continues to provide the adhesive solution for component and substrate bonding for both military and commercial applications. Its thermal interface material solutions of patented phase-change thermal pads, thermal grease and gels and thermal adhesives set many bench marks of performance and reliability for power semiconductor and modules, computer and communication electronics.
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