Nordson YESTECH's advanced 5 megapixel color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewing camera and four side viewing cameras, the FX Series inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.

Programming the FX Series is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The FX Series utilizes a standard package library to simplify training and ensure program portability across manufacturing lines.

Advanced Fusion Lighting™ and newly available 5 megapixel image processing technology integrates several techniques, including color inspection, normalized correlation and rule-based algorithms, to provide complete inspection coverage with an extremely low false failure rate.

Configurable for all line positions, the FX Series is equally effective for paste, pre / post-reflow and final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.

Features:

•5 megapixel color imaging
•1 top-down & 4 side angle cameras
•Quick set-up
•High speed
•High defect coverage
•Low false failure rate