The new ONYX29 provides an unparalleled level of automation and process control for SMT rework and assembly. The new Tool Changer automatically selects and changes nozzles based on program instructions. The new Pick & Prep station provides automatic component pick up and preparaton including flux dipping, paste on device and solder paste dipping. The new Process Development Wizard automatically creates a complete rework process based on user response to five structured prompts. Other key functions include fully automated non-contact site cleaning, force-controlled auto placement and motorized vision/zoom.

ONYX29 Applications
Lead-Free, 0201, Flip Chip, Micro BGA/CSP, MEMS, Optoelectronics, Microwave, MLF’s and other devices. Existing technology including BGA, CSP, Leaded Devices and Surface Mount Connectors can also be easily accommodated.